Semiconductor device and manufacturing method thereof

ABSTRACT

A device includes a substrate, a channel layer, a gate structure, a source/drain epitaxial structure, and a bottom dielectric structure. The channel layer is over the substrate. The gate structure is over the substrate and surrounds the channel layer. The source/drain epitaxial structure is over the substrate and is connected to the channel layer. The bottom dielectric structure is between the source/drain epitaxial structure and the substrate.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-14 illustrate perspective views and cross-sectional views ofintermediate stages in the formation of an integrated circuit structurein accordance with some embodiments of the present disclosure.

FIG. 15 is a cross-sectional view of an integrated circuit structure inaccordance with some embodiments of the present disclosure.

FIGS. 16 and 17 are cross-sectional view of integrated circuitstructures in accordance with some embodiments of the presentdisclosure.

FIG. 18 is a cross-sectional view of an integrated circuit structure inaccordance with some embodiments of the present disclosure.

FIGS. 19-22 illustrate exemplary cross sectional views of various stagesfor manufacturing an integrated circuit structure according to someother embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

As used herein, “around,” “about,” “approximately,” or “substantially”shall generally mean within 20 percent, or within 10 percent, or within5 percent of a given value or range. Numerical quantities given hereinare approximate, meaning that the term “around,” “about,”“approximately,” or “substantially” can be inferred if not expresslystated. One of ordinary skill in the art will appreciate that thedimensions may be varied according to different technology nodes. One ofordinary skill in the art will recognize that the dimensions depend uponthe specific device type, technology generation, minimum feature size,and the like. It is intended, therefore, that the term be interpreted inlight of the technology being evaluated.

The nanostructure transistor (e.g., gate all around (GAA) transistorstructures) may be patterned by any suitable method. For example, thestructures may be patterned using one or more photolithographyprocesses, including double-patterning or multi-patterning processes.Generally, double-patterning or multi-patterning processes combinephotolithography and self-aligned processes, allowing patterns to becreated that have, for example, pitches smaller than what is otherwiseobtainable using a single, direct photolithography process. For example,in one embodiment, a sacrificial layer is formed over a substrate andpatterned using a photolithography process. Spacers are formed alongsidethe patterned sacrificial layer using a self-aligned process. Thesacrificial layer is then removed, and the remaining spacers may then beused to pattern the GAA structure.

The present disclosure is related to integrated circuit structures andmethods of forming the same. More particularly, some embodiments of thepresent disclosure are related to GAA devices including a dielectricstructure under a source/drain epitaxial structure. The dielectricstructure is configured to improve the current leakage problem of thesource/drain epitaxial structures.

FIGS. 1-14 illustrate perspective views and cross-sectional views ofintermediate stages in the formation of an integrated circuit structure(or a semiconductor device) 100 in accordance with some embodiments ofthe present disclosure. In addition to the integrated circuit structure,FIGS. 1-4A, 5A, and 6A depict X-axis, Y-axis, and Z-axis directions. Theformed transistors may include a p-type transistor (such as a p-type GAAFET) and/or an n-type transistor (such as an n-type GAA FET) inaccordance with some exemplary embodiments. Throughout the various viewsand illustrative embodiments, like reference numbers are used todesignate like elements. It is understood that additional operations canbe provided before, during, and after the processes shown by FIGS. 1-14, and some of the operations described below can be replaced oreliminated, for additional embodiments of the method. The order of theoperations/processes may be interchangeable.

FIGS. 1-4A, 5A, and 6A are perspective views of some embodiments of theintegrated circuit structure 100 at intermediate stages duringfabrication. FIGS. 4B, 5B, 6B-12A, and 13-14 are cross-sectional viewsof some embodiments of the integrated circuit structure 100 atintermediate stages during fabrication along a first cut (e.g., cut X-Xin FIG. 4A), which is along a lengthwise direction of the channel andperpendicular to a top surface of the substrate. FIG. 12B is across-sectional view of some embodiments of the integrated circuitstructure 100 at intermediate stages during fabrication along a secondcut (e.g., cut Y-Y in FIG. 4A), which is in the gate region andperpendicular to the lengthwise direction of the channel.

Referring to FIG. 1 , an epitaxial stack 120 is formed over thesubstrate 110. In some embodiments, the substrate 110 may includesilicon (Si). Alternatively, the substrate 110 may include germanium(Ge), silicon germanium (SiGe), a Ill-V material (e.g., GaAs, GaP,GaAsP, AlInAs, AlGaAs, GaInAs, InAs, GaInP, InP, InSb, and/or GaInAsP;or a combination thereof) or other appropriate semiconductor materials.In some embodiments, the substrate 110 may include asemiconductor-on-insulator (SOI) structure such as a buried dielectriclayer. Also alternatively, the substrate 110 may include a burieddielectric layer such as a buried oxide (BOX) layer, such as that formedby a method referred to as separation by implantation of oxygen (SIMOX)technology, wafer bonding, SEG, or another appropriate method.

The epitaxial stack 120 includes epitaxial layers 122 of a firstcomposition interposed by epitaxial layers 124 of a second composition.The first and second compositions can be different. In some embodiments,the epitaxial layers 122 are SiGe and the epitaxial layers 124 aresilicon (Si). However, other embodiments are possible including thosethat provide for a first composition and a second composition havingdifferent oxidation rates and/or etch selectivity. In some embodiments,the epitaxial layers 122 include SiGe and where the epitaxial layers 124include Si, the Si oxidation rate of the epitaxial layers 124 is lessthan the SiGe oxidation rate of the epitaxial layers 122.

The epitaxial layers 124 or portions thereof may form nanostructurechannel(s) of the nanostructure transistor. The term nanostructure isused herein to designate any material portion with nanoscale, or evenmicroscale dimensions, and having an elongate shape, regardless of thecross-sectional shape of this portion. Thus, this term designates bothcircular and substantially circular cross-section elongate materialportions, and beam or bar-shaped material portions including for examplea cylindrical in shape or substantially rectangular cross-section. Forexample, the nanostructures are nanosheets, nanowires, nanoslabs, ornanorings, depending on their geometry. The use of the epitaxial layers124 to define a channel or channels of a device is further discussedbelow.

It is noted that three layers of the epitaxial layers 122 and threelayers of the epitaxial layers 124 are alternately arranged asillustrated in FIG. 1 , which is for illustrative purposes only and notintended to be limiting beyond what is specifically recited in theclaims. It can be appreciated that any number of epitaxial layers can beformed in the epitaxial stack 120; the number of layers depending on thedesired number of channels regions for the transistor. In someembodiments, the number of epitaxial layers 124 is between 2 and 10.

As described in more detail below, the epitaxial layers 124 may serve aschannel region(s) for a subsequently-formed semiconductor device and thethickness is chosen based on device performance considerations. Theepitaxial layers 122 in channel regions(s) may eventually be removed andserve to define a vertical distance between adjacent channel region(s)for a subsequently-formed multi-gate device and the thickness is chosenbased on device performance considerations. Accordingly, the epitaxiallayers 122 may also be referred to as sacrificial layers, and epitaxiallayers 124 may also be referred to as channel layers.

By way of example, epitaxial growth of the layers of the stack 120 maybe performed by a molecular beam epitaxy (MBE) process, a metalorganicchemical vapor deposition (MOCVD) process, and/or other suitableepitaxial growth processes. In some embodiments, the epitaxially grownlayers such as, the epitaxial layers 124 include the same material asthe substrate 110. In some embodiments, the epitaxially grown layers 122and 124 include a different material than the substrate 110. As statedabove, in at least some examples, the epitaxial layers 122 include anepitaxially grown silicon germanium (SiGe) layer and the epitaxiallayers 124 include an epitaxially grown silicon (Si) layer.Alternatively, in some embodiments, either of the epitaxial layers 122and 124 may include other materials such as germanium, a compoundsemiconductor such as silicon carbide, gallium arsenide, galliumphosphide, indium phosphide, indium arsenide, and/or indium antimonide,an alloy semiconductor such as SiGe, GaAsP, AlInAs, AlGaAs, InGaAs,GaInP, and/or GaInAsP, or combinations thereof. As discussed, thematerials of the epitaxial layers 122 and 124 may be chosen based onproviding differing oxidation and/or etching selectivity properties. Insome embodiments, the epitaxial layers 122 and 124 are substantiallydopant-free (i.e., having an extrinsic dopant concentration from about 0cm⁻³ to about 1×10¹⁸ cm⁻³), where for example, no intentional doping isperformed during the epitaxial growth process.

Referring to FIG. 2 , a plurality of semiconductor fins 130 extendingfrom the substrate 110 are formed. In various embodiments, each of thefins 130 includes a substrate portion 112 formed from the substrate 110and portions of each of the epitaxial layers of the epitaxial stackincluding epitaxial layers 122 and 124. The fins 130 may be fabricatedusing suitable processes including double-patterning or multi-patterningprocesses. Generally, double-patterning or multi-patterning processescombine photolithography and self-aligned processes, allowing patternsto be created that have, for example, pitches smaller than what isotherwise obtainable using a single, direct photolithography process.For example, in one embodiment, a sacrificial layer is formed over asubstrate and patterned using a photolithography process. Spacers areformed alongside the patterned sacrificial layer using a self-alignedprocess. The sacrificial layer is then removed, and the remainingspacers, or mandrels, may then be used to pattern the fins 130 byetching initial epitaxial stack 120. The etching process can include dryetching, wet etching, reactive ion etching (RIE), and/or other suitableprocesses.

In the illustrated embodiment as illustrated in FIGS. 1 and 2 , a hardmask (HM) layer 910 is formed over the epitaxial stack 120 prior topatterning the fins 130. In some embodiments, the HM layer includes anoxide layer 912 (e.g., a pad oxide layer that may include SiO₂) and anitride layer 914 (e.g., a pad nitride layer that may include SiO₃N₄)formed over the oxide layer. The oxide layer 912 may act as an adhesionlayer between the epitaxial stack 120 and the nitride layer 914 and mayact as an etch stop layer for etching the nitride layer 914. In someexamples, the HM oxide layer 912 includes thermally grown oxide,chemical vapor deposition (CVD)-deposited oxide, and/or atomic layerdeposition (ALD)-deposited oxide. In some embodiments, the HM nitridelayer 914 is deposited on the HM oxide layer 912 by CVD and/or othersuitable techniques.

The fins 130 may subsequently be fabricated using suitable processesincluding photolithography and etch processes. The photolithographyprocess may include forming a photoresist layer (not shown) over the HMlayer 910, exposing the photoresist to a pattern, performingpost-exposure bake processes, and developing the resist to form apatterned mask including the resist. In some embodiments, patterning theresist to form the patterned mask element may be performed using anelectron beam (e-beam) lithography process or an extreme ultraviolet(EUV) lithography process using light in EUV region, having a wavelengthof, for example, about 1-200 nm. The patterned mask may then be used toprotect regions of the substrate 110, and layers formed thereupon, whilean etch process forms trenches 102 in unprotected regions through the HMlayer 910, through the epitaxial stack 120, and into the substrate 110,thereby leaving the plurality of extending fins 130. The trenches 102may be etched using a dry etch (e.g., reactive ion etching), a wet etch,and/or combination thereof. Numerous other embodiments of methods toform the fins on the substrate may also be used including, for example,defining the fin region (e.g., by mask or isolation regions) andepitaxially growing the epitaxial stack 120 in the form of the fins 130.

Next, as illustrated in FIG. 3 , isolation regions 140 are formedinterposing the fins 130. The isolation regions 140 may include a lineroxide (not shown). The liner oxide may be formed of a thermal oxideformed through a thermal oxidation of a surface layer of the substrate110. The liner oxide may also be a deposited silicon oxide layer formedusing, for example, Atomic Layer Deposition (ALD), High-Density PlasmaChemical Vapor Deposition (HDPCVD), or Chemical Vapor Deposition (CVD).The isolation regions 140 may also include a dielectric material overthe liner oxide, and the dielectric material may be formed usingflowable chemical vapor deposition (FCVD), spin-on coating, or the like.

The isolation regions 140 are then recessed, so that the top portions ofthe epitaxial stack 120 protrude higher than the top surfaces of theneighboring isolation regions 140 to form protruding fins 130. Theetching may be performed using a dry etching process, wherein NH₃ andNF₃ are used as the etching gases. During the etching process, plasmamay be generated. Argon may also be included. In accordance withalternative embodiments of the present disclosure, the recessing of theisolation regions 140 is performed using a wet etch process. The etchingchemical may include diluted HF, for example.

Reference is made to FIGS. 4A and 4B. Dummy gate structures 150 areformed over the substrate 110 and are at least partially disposed overthe fins 130. The portions of the fins 130 underlying the dummy gatestructures 150 may be referred to as the channel region. The dummy gatestructures 150 may also define source/drain (SID) regions of the fins130, for example, the regions of the fins 130 adjacent and on opposingsides of the channel regions.

Dummy gate formation operation first forms a dummy gate dielectric layer152 over the fins 130. Subsequently, a dummy gate electrode layer 154and a hard mask which may include multiple layers 156 and 158 (e.g., anoxide layer 156 and a nitride layer 158) are formed over the dummy gatedielectric layer 152. The hard mask is then patterned, followed bypatterning the dummy gate dielectric layer 152 by using the patternedhard mask as an etch mask. In some embodiments, after patterning thedummy gate electrode layer 154, the dummy gate dielectric layer 152 isremoved from the S/D regions of the fins 130. The etch process mayinclude a wet etch, a dry etch, and/or a combination thereof. The etchprocess is chosen to selectively etch the dummy gate dielectric layer152 without substantially etching the fins 130, the dummy gate electrodelayer 154, the oxide mask layer 156 and the nitride mask layer 158.

After formation of the dummy gate structures 150 is completed, gatespacers 160 are formed on sidewalls of the dummy gate structures 150.For example, a spacer material layer is deposited on the substrate 110.The spacer material layer may be a conformal layer that is subsequentlyetched back to form gate sidewall spacers. In the illustratedembodiment, a spacer material layer 160 is disposed conformally on topand sidewalls of the dummy gate structures 150. The spacer materiallayer 160 may include a dielectric material such as silicon oxide,silicon nitride, silicon carbide, silicon oxynitride, SiCN films,silicon oxycarbide, SiOCN films, and/or combinations thereof. In someembodiments, the spacer material layer 160 includes multiple layers,such as a first spacer layer 162 and a second spacer layer 164(illustrated in FIG. 4B) formed over the first spacer layer 162. By wayof example, the spacer material layer 160 may be formed by depositing adielectric material over the dummy gate structures 150 using suitabledeposition processes. An anisotropic etching process is then performedon the deposited spacer material layer 160 to expose portions of thefins 130 not covered by the dummy gate structure 150 (e.g., insource/drain regions of the fins 130). Portions of the spacer materiallayer directly above the dummy gate structure 150 may be completelyremoved by this anisotropic etching process. Portions of the spacermaterial layer on sidewalls of the dummy gate structure 150 may remain,forming gate sidewall spacers, which are denoted as the gate spacers160, for the sake of simplicity. It is noted that although the gatespacers 160 are multi-layer structures in the cross-sectional view ofFIG. 4B, they are illustrated as single-layer structures in theperspective view of FIG. 4A for the sake of simplicity.

Next, as illustrated in FIGS. 5A and 5B, exposed portions of thesemiconductor fins 130 that extend laterally beyond the gate spacers 160(e.g., in source/drain regions S/D of the fins 130) are etched by using,for example, an anisotropic etching process that uses the dummy gatestructure 150 and the gate spacers 160 as an etch mask, resulting inrecesses R1 into the semiconductor fins 130 and between correspondingdummy gate structures 150. After the anisotropic etching, end surfacesof the epitaxial layers 122 and channel layers 124 and respectiveoutermost sidewalls of the gate spacers 160 are substantiallycoterminous, due to the anisotropic etching. In some embodiments, theanisotropic etching may be performed by a dry chemical etch with aplasma source and a reaction gas. The plasma source may be aninductively coupled plasma (ICR) source, a transformer coupled plasma(TCP) source, an electron cyclotron resonance (ECR) source or the like,and the reaction gas may be, for example, a fluorine-based gas (such asSF₆, CH₂F₂, CH₃F, CHF₃, or the like), chloride-based gas (e.g., Cl₂),hydrogen bromide gas (HBr), oxygen gas (O₂), the like, or combinationsthereof.

The substrate portions 112 are also recessed to form recesses R1′ inthis anisotropic etching process. In some embodiments, the reaction gasfor etching the substrate portions 112 is a gaseous mixture of HBr andHe. In this anisotropic etching process, the gaseous mixture etches thesubstrate portions 112 at a vertical etch rate and a lateral etch rateslower than the vertical etch rate. With more HBr, the vertical etchrate increases; with more He, the lateral etch rate increases. As such,the shape of the recesses R1′ can be adjusted by tuning the ratio of HBrto He. For example, HBr:He is in a range from about 1:1 to about 1:8 toobtain V-shaped recesses R1′ in a cross-sectional view (see FIG. 5B). IfHBr:He is greater than about 1:8, the recesses R1′ have U-shapes in thecross-sectional view (i.e., the lateral etch rate increases). If HBr:Heis less than about 1:1, the recesses R1′ are not deep enough toaccommodate bottom dielectric structures 174 (see FIG. 8 ).

In some other embodiments, the shape of the recesses R1′ can be adjustedby tuning the pressure of the reaction gas. For example, the pressure ofthe reaction gas is in a range from about 3 mtorr to about 10 mtorr. Ifthe pressure is greater than about 10 mtorr, the etching rate may be tooslow; if the pressure is less than about 3 mtorr, the recesses R1′ mayhave U-shapes in the cross-sectional view.

In some embodiments, each of the recesses R1′ has a depth H1. Forexample, the depth H1 is in a range from about 1 nm to about 500 nm. Ifthe depth H1 is greater than about 500 nm, source/drain epitaxialstructures 180 (see FIG. 9A) may be not easy to be deposited on thebottom dielectric structures 174 (see FIG. 9A); if the depth H1 is lessthan about 1 nm, there is no space to accommodate the bottom dielectricstructures 174, and the source/drain epitaxial structures 180 may havecurrent leakage problems. In some embodiments, the recesses R1′ has anaspect ratio (defined for recesses as the ratio of the recess depthH1/width WI) greater than about 1.3, e.g., in a range from about 1.3 toabout 15. The recesses R1 are more like V-shapes in the cross-sectionalview with high aspect ratio, and are more like U-shapes in thecross-sectional view with low aspect ratio.

Next, in FIGS. 6A and 6B, the epitaxial layers 122 are laterally orhorizontally recessed by using suitable etch techniques, resulting inlateral recesses R2 each vertically between corresponding channel layers124. This operation may be performed by using a selective etchingprocess. By way of example and not limitation, the epitaxial layers 122are SiGe and the channel layers 124 are silicon allowing for theselective etching of the epitaxial layers 122. In some embodiments, theselective wet etching includes an APM etch (e.g., ammoniahydroxide-hydrogen peroxide-water mixture) that etches SiGe at a fasteretch rate than it etches Si. In some embodiments, the selective etchingincludes SiGe oxidation followed by a SiGeO_(x) removal. For example,the oxidation may be provided by O₃ clean and then SiGeO_(x) removed byan etchant such as NH₄OH that selectively etches SiGeO_(x) at a fasteretch rate than it etches Si. Moreover, because oxidation rate of Si ismuch lower (sometimes 30 times lower) than oxidation rate of SiGe, thechannel layers 124 is not significantly etched by the process oflaterally recessing the epitaxial layers 122. As a result, the channellayers 124 laterally extend past opposite end surfaces of the epitaxiallayers 122.

In FIG. 7 , spacer material layers 170′ are formed to fill the recessesR2 left by the lateral etching of the epitaxial layers 122 discussedabove with reference to FIGS. 6A and 6B. Portions of the spacer materiallayers 170′ are deposited in the recesses R1′ as well. The spacermaterial layer 170′ may be a low-k dielectric material, such as SiO₂,SiN, SiC, SiON, SiCN, or SiOCN, and may be formed by a suitabledeposition method, such as ALD. In some embodiments, the innerdielectric spacer material layer 170′ is intrinsic or un-doped withimpurities. The spacer material layer 170′ can be formed using CVD,including LPCVD and PECVD, PVD, ALD, or other suitable processes. Insome embodiments, despite the spacer material layers 170′ areconformally formed in the recesses R1′, the spacer material layer 170′is easier to be merged in the V-shaped recess R1′ than in a U-shapedrecess. The merged spacer material layer 170′ results in thick bottomdielectric structures 174 (see FIG. 8 ).

Referring to FIG. 8 , after the deposition of the spacer material layer170′, an anisotropic etching process ET1 may be performed to trim thedeposited spacer material layer 170′, such that portions of thedeposited spacer material layer 170′ that fill the recesses R2 left bythe lateral etching of the epitaxial layers 122 are left, and anotherportion of the deposited spacer material layers 170′ that deposited inthe bottom of the recesses R1′ left by the etching of the fin structures130 are left. After the trimming process, the remaining portions of thedeposited spacer material are denoted as inner dielectric spacers 172 inthe recesses R2 and bottom dielectric structures 174 in the recessesR1′, for the sake of simplicity. The inner dielectric spacers 172 serveto isolate metal gates from source/drain epitaxial structures formed insubsequent processing, and the bottom dielectric structures 174 serve toisolate source/drain epitaxial structures from the substrate 110. In theexample of FIG. 8 , sidewalls of the inner dielectric spacers 172 aresubstantially aligned with sidewalls of the channel layers 124.

In some embodiments, the anisotropic etching process ET1 is a plasmaetching. The substrate 110 having the structure illustrated in FIG. 7can be loaded into a plasma tool and exposed to a plasma environmentgenerated by RF or microwave power in a gaseous mixture of a fluorinecontaining gas, such as CHF₃, CF₄, C₄F₈, C₅F₈, C₄F₆, or similar species,an inert gas, such as argon or helium, for a duration time sufficient toetch portions of the spacer material layer 170′ outside the recesses R1′and R2. A plasma generated in a gaseous mixture including CHF₃, CF₄ andargon can be used to tune the shape of the bottom dielectric structures174. With more fluorine, the lateral etching rate of the plasma etchingis increased, and more amount of the bottom dielectric structures 174remains. The plasma is generated by RF power with a bias greater than 0and equal to or less than about 30 V. If the bias is greater than about30V, the bottom dielectric structures 174 may be completely removed; ifthe bias is absent, the inner dielectric spacers 172 may be over-etched.

In FIG. 9A, source/drain epitaxial structures 180 are formed over thesource/drain regions S/D of the semiconductor fins 130. The source/drainepitaxial structures 180 may be formed by performing an epitaxial growthprocess that provides an epitaxial material on the fins 130. During theepitaxial growth process, the dummy gate structures 150, gate sidewallspacers 160, the inner dielectric spacers 172, and the bottom dielectricstructures 174 limit the source/drain epitaxial structures 180 to thesource/drain regions S/D. In some embodiments, the lattice constants ofthe epitaxy structures 180 are different from the lattice constant ofthe epitaxial layers 124, so that the epitaxial layers 124 can bestrained or stressed by the epitaxy structures 180 to improve carriermobility of the semiconductor device and enhance the device performance.The epitaxy processes include CVD deposition techniques (e.g., PECVD,vapor-phase epitaxy (VPE) and/or ultra-high vacuum CVD (UHV-CVD)),molecular beam epitaxy, and/or other suitable processes. The epitaxyprocess may use gaseous and/or liquid precursors, which interact withthe composition of the epitaxial layers 124.

In some embodiments, the source/drain epitaxial structures 180 mayinclude Ge, Si, GaAs, AlGaAs, SiGe, GaAsP, SiP, or other suitablematerial. The source/drain epitaxial structures 180 may be in-situ dopedduring the epitaxial process by introducing doping species including:p-type dopants, such as boron or BF₂; n-type dopants, such as phosphorusor arsenic; and/or other suitable dopants including combinationsthereof. If the source/drain epitaxial structures 180 are not in-situdoped, an implantation process (i.e., a junction implant process) isperformed to dope the source/drain epitaxial structures 180. In someexemplary embodiments, the source/drain epitaxial structures 180 in ann-type transistor include SiP, while those in a p-type include GeSnBand/or SiGeSnB. In embodiments with different device types, a mask, suchas a photoresist, may be formed over n-type device regions, whileexposing p-type device regions, and p-type epitaxial structures may beformed on the bottom dielectric structures 174 in the p-type deviceregions. The mask may then be removed. Subsequently, a mask, such as aphotoresist, may be formed over the p-type device region while exposingthe n-type device regions, and n-type epitaxial structures may be formedon the bottom dielectric structures 174 in the n-type device region. Themask may then be removed.

Once the source/drain epitaxial structures 180 are formed, an annealingprocess can be performed to activate the p-type dopants or n-typedopants in the source/drain epitaxial structures 180. The annealingprocess may be, for example, a rapid thermal anneal (RTA), a laseranneal, a millisecond thermal annealing (MSA) process or the like.

FIGS. 9B and 9C are enlarged views of area A in FIG. 9A according tosome embodiments. In FIG. 9B, the lower the inner dielectric spacers172, the larger size of the inner dielectric spacers 172. In someembodiments, the size of the inner dielectric spacers 172 is determinedby the size of the recesses R2 (see FIG. 6B), which can be tuned duringthe lateral recessing process shown in FIG. 6B. Further, the bottomdielectric structures 174 expose portions of the inner surfaces of therecesses R1′. With such configuration, the source/drain epitaxystructures 180 may fill the rest of the recesses R1′. That is, thesource/drain epitaxy structures 180 are in contact with the substrate110; be that as it may, the bottom dielectric structures 174 in FIG. 9Balso improve the current leakage problem of the source/drain epitaxystructures 180. In FIG. 9C, at least one of the inner dielectric spacers172 and/or the bottom dielectric structure 174 has a void 175 therein.The void 175 is defined by the inner dielectric spacer 172 and thesource/drain epitaxy structures 180 or by the bottom dielectricstructure 174 and the source/drain epitaxy structures 180. Since thespacer material layers 170′ (see FIG. 7 ) is conformally formed in therecesses R1′ and R2, the spacer material layers 170′ may not fill therecesses R1′ and/or R2 if the spacer material layers 170′ are thin. Assuch, after the anisotropic etching process ET1 in FIG. 8 , void(s) 175may be formed in the inner dielectric spacers 172 and/or the bottomdielectric structure 174.

In FIG. 10 , an interlayer dielectric (ILD) layer 210 is formed on thesubstrate 110. In some embodiments, a contact etch stop layer (CESL) isalso formed prior to forming the ILD layer 210. In some examples, theCESL includes a silicon nitride layer, silicon oxide layer, a siliconoxynitride layer, and/or other suitable materials having a differentetch selectivity than the ILD layer 210. The CESL may be formed byplasma-enhanced chemical vapor deposition (PECVD) process and/or othersuitable deposition or oxidation processes. In some embodiments, the ILDlayer 210 includes materials such as tetraethylorthosilicate(TEOS)-formed oxide, un-doped silicate glass, or doped silicon oxidesuch as borophosphosilicate glass (BPSG), fused silica glass (FSG),phosphosilicate glass (PSG), boron doped silicon glass (BSG), and/orother suitable dielectric materials having a different etch selectivitythan the CESL. The ILD layer 210 may be deposited by a PECVD process orother suitable deposition technique. In some embodiments, afterformation of the ILD layer 210, the wafer may be subject to a highthermal budget process to anneal the ILD layer 210.

In some examples, after depositing the ILD layer 210, a planarizationprocess may be performed to remove excessive materials of the ILD layer210. For example, a planarization process includes a chemical mechanicalplanarization (CMP) process which removes portions of the ILD layer 210(and CESL layer, if present) overlying the dummy gate structures 150 andplanarizes a top surface of the integrated circuit structure 100. Insome embodiments, the CMP process also removes hard mask layers 156 and158 (as shown in FIG. 9A) and exposes the dummy gate electrode layer154.

Thereafter, the dummy gate structures 150 (as shown in FIG. 9A) areremoved first, and then the epitaxial layers (i.e., sacrificial layers)122 (as shown in FIG. 10 ) are removed. The resulting structure isillustrated in FIG. 11 . In some embodiments, the dummy gate structures150 are removed by using a selective etching process (e.g., selectivedry etching, selective wet etching, or a combination thereof) thatetches the materials in dummy gate structures 150 at a faster etch ratethan it etches other materials (e.g., gate sidewall spacers 160 and/orILD layer 210), thus resulting in gate trenches GT1 betweencorresponding gate sidewall spacers 160, with the epitaxial layers 122exposed in the gate trenches GT1. Subsequently, the epitaxial layers 122in the gate trenches GT1 are removed by using another selective etchingprocess that etches the epitaxial layers 122 at a faster etch rate thanit etches the channel layers 124, thus forming openings O1 betweenneighboring epitaxial layers (i.e., channel layers) 124. In this way,the epitaxial layers 124 become nanosheets suspended over the substrate110 and between the source/drain epitaxial structures 180. Thisoperation is also called a channel release process. At this interimprocessing operation, the openings O1 between the epitaxial layers(i.e., nanosheets) 124 may be filled with ambient environment conditions(e.g., air, nitrogen, etc). In some embodiments, the epitaxial layers124 can be interchangeably referred to as nanostructure (nanowires,nanoslabs and nanorings, nanosheet, etc., depending on their geometry).For example, in some other embodiments the epitaxial layers 124 may betrimmed to have a substantial rounded shape (i.e., cylindrical) due tothe selective etching process for completely removing the epitaxiallayers 122. In that case, the resultant epitaxial layers 124 can becalled nanowires.

In some embodiments, the epitaxial layers 122 are removed by using aselective wet etching process. In some embodiments, the epitaxial layers122 are SiGe and the epitaxial layers 124 are silicon allowing for theselective removal of the epitaxial layers 122. In some embodiments, theselective wet etching includes an AFM etch (e.g., ammoniahydroxide-hydrogen peroxide-water mixture). In some embodiments, theselective removal includes SiGe oxidation followed by a SiGeO_(x)removal. For example, the oxidation may be provided by O₃ clean and thenSiGeO_(x) removed by an etchant such as NH₄OH that selectively etchesSiGeO_(x) at a faster etch rate than it etches Si. Moreover, becauseoxidation rate of Si is much lower (sometimes 30 times lower) thanoxidation rate of SiGe, the channel layers 124 may not be significantlyetched by the channel release process. It can be noted that both thechannel release operation and the previous operation of laterallyrecessing sacrificial layers (the operation as shown in FIGS. 6A and 6B)use a selective etching process that etches SiGe at a faster etch ratethan etching Si, and therefore these two operations may use the sameetchant chemistry in some embodiments. In this case, the etchingtime/duration of channel release operation is longer than the etchingtime/duration of the previous operation of laterally recessingsacrificial layers, so as to completely remove the sacrificial SiGelayers.

In FIGS. 12A and 12B, replacement gate structures 220 are respectivelyformed in the gate trenches GT1 to surround each of the epitaxial layers124 suspended in the gate trenches GT1. The gate structure 220 may bethe final gate of a GAA FET. The final gate structure may be ahigh-k/metal gate stack, however other compositions are possible. Insome embodiments, each of the gate structures 220 forms the gateassociated with the multi-channels provided by the plurality ofepitaxial layers 124. For example, high-k/metal gate structures 220 areformed within the openings O1 (as illustrated in FIG. 12A) provided bythe release of epitaxial layers 124. In various embodiments, thehigh-k/metal gate structure 220 includes a gate dielectric layer 222formed around the epitaxial layers 124, a work function metal layer 224formed around the gate dielectric layer 222, and a fill metal 226 formedaround the work function metal layer 224 and filling a remainder of gatetrenches GT1. The gate dielectric layer 222 includes an interfaciallayer (e.g., silicon oxide layer) and a high-k gate dielectric layerover the interfacial layer. High-k gate dielectrics include dielectricmaterials having a high dielectric constant, for example, greater thanthat of thermal silicon oxide (˜3.9). The work function metal layer 224and/or fill metal layer 226 used within high-k/metal gate structures 220may include a metal, metal alloy, or metal silicide. Formation of thehigh-k/metal gate structures 220 may include depositions to form variousgate materials, one or more liner layers, and one or more CMP processesto remove excessive gate materials. As illustrated in a cross-sectionalview of FIG. 12B that is taken along a longitudinal axis of ahigh-k/metal gate structure 220, the high-k/metal gate structure 220surrounds each of the epitaxial layers 124, and thus is referred to as agate of a GAA FET.

In some embodiments, the interfacial layer of the gate dielectric layer222 may include a dielectric material such as silicon oxide (SiO₂),HfSiO, or silicon oxynitride (SiON). The interfacial layer may be formedby chemical oxidation, thermal oxidation, atomic layer deposition (ALD),chemical vapor deposition (CVD), and/or other suitable method. Thehigh-k dielectric layer of the gate dielectric layer 222 may includehafnium oxide (HfO₂). Alternatively, the gate dielectric layer 222 mayinclude other high-k dielectrics, such as hafnium silicon oxide (HfSiO),hafnium silicon oxynitride (HfSiON), hafnium tantalum oxide (HfTaO),hafnium titanium oxide (HfTiO), hafnium zirconium oxide (HfZrO),lanthanum oxide (LaO), zirconium oxide (ZrO), titanium oxide (TiO),tantalum oxide (Ta₂O₅), yttrium oxide (Y₂O₃), strontium titanium oxide(SrTiO₃, STO), barium titanium oxide (BaTiO₃, BTO), barium zirconiumoxide (BaZrO), hafnium lanthanum oxide (HfLaO), lanthanum silicon oxide(LaSiO), aluminum silicon oxide (AlSiO), aluminum oxide (Al₂O₃), siliconnitride (Si₃N₄), siliconoxynitrides (SiON), and combinations thereof.

The work function metal layer 224 may include work function metals toprovide a suitable work function for the high-k/metal gate structures220. For an n-type FinFET, the work function metal layer 224 may includeone or more n-type work function metals (N-metal). The n-type workfunction metals may exemplarily include, but are not limited to,titanium aluminide (TiAl), titanium aluminium nitride (TiAlN),carbo-nitride tantalum (TaCN), hafnium (Hf), zirconium (Zr), titanium(Ti), tantalum (Ta), aluminum (Al), metal carbides (e.g., hafniumcarbide (HfC), zirconium carbide (ZrC), titanium carbide (TiC), aluminumcarbide (AIC)), aluminides, and/or other suitable materials. On theother hand, for a p-type FinFET, the work function metal layer 134 mayinclude one or more p-type work function metals (P-metal). The p-typework function metals may exemplarily include, but are not limited to,titanium nitride (TiN), tungsten nitride (WN), tungsten (W), ruthenium(Ru), palladium (Pd), platinum (Pt), cobalt (Co), nickel (Ni),conductive metal oxides, and/or other suitable materials.

In some embodiments, the fill metal 226 may exemplarily include, but arenot limited to, tungsten, aluminum, copper, nickel, cobalt, titanium,tantalum, titanium nitride, tantalum nitride, nickel silicide, cobaltsilicide, TaC, TaSiN, TaCN, TiAl, TiAlN, or other suitable materials.

In FIG. 13 , optionally, an etching back process is performed to etchback the replacement gate structures 220, resulting in recesses over theetched-back gate structures 220. In some embodiments, because thematerials of the replacement gate structures 220 have a different etchselectivity than the gate spacers 160, the top surfaces of thereplacement gate structures 220 may be at a lower level than the topsurfaces of the gate spacers 160.

Dielectric caps 230 are optionally formed over the etched-back gatestructures 220. The dielectric cap layer 230 includes SiN_(x),Al_(x)O_(y), AEON, SiO_(x)C_(y), SiC_(x)N_(y), combinations thereof orthe like, and is formed by a suitable deposition technique such as CVD,plasma-enhanced CVD (PECVD), ALD, remote plasma ALD (RPALD),plasma-enhanced ALD (PEALD), combinations thereof or the like. A CMPprocess is then performed to remove the cap layer outside the recesses,leaving portions of the dielectric cap layer in the recesses to serve asdielectric caps 230.

In FIG. 14 , source/drain contacts 240 are formed extending through theILD layer 210 (and the CESL layer, if present). Formation of thesource/drain contacts 240 includes, by way of example and notlimitation, performing one or more etching processes to form contactopenings extending though the ILD layer 210 to expose the source/drainepitaxy structures 180, depositing one or more metal materialsoverfilling the contact openings, and then performing a CMP process toremove excessive metal materials outside the contact openings. In someembodiments, the one or more etching processes are selective etchingthat etches the ILD layer 210 at a faster etch rate than etching thedielectric caps 230 and the gate spacers 160. As a result, the selectiveetching is performed using the dielectric caps 230 and the gate spacers160 as an etch mask, such that the contact openings and hence thesource/drain contacts 240 are formed self-aligned to the source/drainepitaxy structures 180 without using an additional photolithographyprocess. In that case, the dielectric caps 230 allowing for forming theself-aligned contacts 240 can be called SAC caps 230.

The integrated circuit structure 100 includes the substrate 110, thechannel layers 124 arranged one above another in a spaced apart mannerover the substrate 110, the gate structure 220 surrounding/wrapping eachof the channel layers 124, the source/drain epitaxial structures 180connected to the channel layers 124, and the bottom dielectricstructures 174 between the source/drain epitaxial structures 180 and thesubstrate 110. That is, the source/drain epitaxial structures 180 areseparated from the substrate 110 by the bottom dielectric structures174. The bottom dielectric structures 174 are respectively below thesource/drain epitaxial structures 180 to prevent the current of thesource/drain epitaxial structures 180 from leaking into the substrate110 and then to the other source/drain epitaxial structures 180.

In some embodiments, the bottom dielectric structure 174 is embedded inthe substrate 110 and is conformal to the inner surface of the recessR1′ of the substrate 110. That is, the bottom dielectric structure 174has a curved (convex) bottom surface and a curved (concave) top surface.The top surface 174 a of the bottom dielectric structure 174 is lowerthan the top surface 111 of the substrate 110. A maximum thickness H2 ofthe bottom dielectric structure 174 is in a range from about 1 nm toabout 500 nm. If the thickness H2 is greater than about 500 nm, thesource/drain epitaxial structures 180 may be not easy to be deposited onthe bottom dielectric structures 174; if the thickness H2 is less thanabout 1 nm, the source/drain epitaxial structures 180 may have currentleakage problems.

In some embodiments, the integrated circuit structure 100 furtherincludes the inner dielectric spacers 172 between the gate structure 220and the source/drain epitaxial structures 180. As described in FIGS. 7-8, since the inner dielectric spacers 172 and the bottom dielectricstructures 174 are formed in the same process, the inner dielectricspacers 172 and the bottom dielectric structures 174 have the samematerials.

FIG. 15 is a cross-sectional view of an integrated circuit structure (ora semiconductor device) 100 a in accordance with some embodiments of thepresent disclosure. The difference between the integrated circuitstructure 100 a in FIG. 15 and the integrated circuit structure 100 inFIG. 14 pertains to the shape of the source/drain epitaxial structures180. In FIG. 15 , at least one void (or air gap) 182 is formed betweenthe source/drain epitaxial structure 180 and the bottom dielectricstructure 174. The void 182 may be formed in the epitaxial growthprocess described in FIG. 9A. The epitaxial growth process may be aselectively epitaxial growth (SEG) process, which has a higher growthrate over a semiconductive material (e.g., the channel layers 124) thanover a dielectric material (e.g., the bottom dielectric structures 174and the inner dielectric spacers 172). As such, at least a portion ofthe source/drain epitaxial structures 180 may be suspended over thebottom dielectric structures 174 and form voids under the source/drainepitaxial structures 180. In some embodiments, the shape of thesource/drain epitaxial structures 180 can be adjusted by tuning recipesof the epitaxial growth process. Other relevant structural andmanufacturing details of the integrated circuit structure 100 a aresubstantially the same or similar to the integrated circuit structure100 of FIG. 14 , and, therefore, a description in this regard will notbe repeated hereinafter.

FIGS. 16 and 17 are cross-sectional view of integrated circuitstructures (or semiconductor devices) 100 b and 100 c in accordance withsome embodiments of the present disclosure. The difference among theintegrated circuit structure 100 b in FIG. 16 , the integrated circuitstructure 100 c in FIG. 17 , and the integrated circuit structure 100 inFIG. 14 pertains to the shape of the bottom dielectric structures 174.In FIG. 16 , the bottom dielectric structure 174 has a substantiallyplanar top surface, and in FIG. 17 , the bottom dielectric structure 174has a convex top surface. That is, the top surface 174 a of the bottomdielectric structure 174 is substantially level with the top surface 111of the substrate 110 in FIG. 16 , and the top surface 174 a of thebottom dielectric structure 174 is higher than the top surface 111 ofthe substrate 110 in FIG. 17 . In some embodiments, the shape of thebottom dielectric structures 174 is adjusted by tuning the depth of therecesses R1′. For example, the depths Hb and Hc of the recesses R1′ inFIGS. 16 and 17 are shallower than the depth H1 of the recesses R1′ inFIG. 5B. Therefore, the spacer material layers 170′ (see FIG. 7 ) areeasier to fill the recesses R1′ in FIGS. 16 and 17 . As such, after theanisotropic etching process ET1 shown in FIG. 8 , more spacer materiallayers 170′ are left in the recesses R1′ of FIGS. 16 and 17 .Alternatively or additionally, more fluorine can be added in the plasmafor etching the spacer material layer 170′ to form the bottom dielectricstructures 174 shown in FIGS. 16 and 17 . Other relevant structural andmanufacturing details of the integrated circuit structures 100 b and 100c are substantially the same or similar to the integrated circuitstructure 100 of FIG. 14 , and, therefore, a description in this regardwill not be repeated hereinafter.

FIG. 18 is a cross-sectional view of an integrated circuit structure (ora semiconductor device) 100 d in accordance with some embodiments of thepresent disclosure. The difference among the integrated circuitstructure 100 d in FIG. 18 and the integrated circuit structure 100 inFIG. 14 pertains to the shape of the bottom dielectric structures 174.In FIG. 18 , the bottom dielectric structures 174 are formed in thebottom of the recesses R1′ and expose portions of the inner surfaces ofthe recesses R1′. In some embodiments, the shape of the bottomdielectric structures 174 is adjusted by tuning the depth of the recessR1′. For example, the depth Hd of the recesses R1′ in FIG. 18 is deeperthan the depth H1 of the recesses R1′ in FIG. 5B. Therefore, the spacermaterial layers 170′ (see FIG. 7 ) may be formed at the bottom of therecesses R1′ in FIG. 18 . As such, after the anisotropic etching processET1 shown in FIG. 8 , less spacer material layers 170′ are left in therecesses R1′ of FIG. 18 . Alternatively or additionally, less fluorineare added in the plasma for etching the spacer material layer 170′ toform the bottom dielectric structures 174 shown in FIG. 18 . With suchconfiguration, the source/drain epitaxy structures 180 may fill the restof the recesses R1′. That is, the source/drain epitaxy structures 180are in contact with the substrate 110; be that as it may, the bottomdielectric structures 174 in FIG. 18 also improve the current leakageproblem of the source/drain epitaxy structures 180. Other relevantstructural and manufacturing details of the integrated circuit structure100 d are substantially the same or similar to the integrated circuitstructure 100 of FIG. 14 , and, therefore, a description in this regardwill not be repeated hereinafter.

In some embodiments, the inner dielectric spacers 172 and the bottomdielectric structure 174 may include different materials. As such, theinner dielectric spacers 172 and the bottom dielectric structure 174 areformed in different processes. FIGS. 19-22 illustrate exemplary crosssectional views of various stages for manufacturing an integratedcircuit structure (or a semiconductor device) 100 e according to someother embodiments of the present disclosure. It is understood thatadditional operations can be provided before, during, and afterprocesses shown by FIGS. 19-22 , and some of the operations describedbelow can be replaced or eliminated, for additional embodiments of themethod. The order of the operations/processes may be interchangeable.The same or similar configurations, materials, processes and/oroperation as described with FIGS. 1-14 may be employed in the followingembodiments, and the detailed explanation may be omitted.

After the structure as shown in FIG. 7 is formed, an anisotropic etchingprocess ET1′ is performed to trim the deposited spacer material layer170′ as shown in FIG. 19 , such that portions of the deposited spacermaterial layer 170′ that fill the recesses R2 left by the lateraletching of the epitaxial layers 122 are left, and another portion of thedeposited spacer material layer 170′ that deposited in the bottom of therecesses R1′ left by the etching of the fin structures 130 are removed.After the trimming process, the remaining portions of the depositedspacer material are denoted as inner dielectric spacers 172 in therecesses R2, for the sake of simplicity. During this anisotropic etchingprocess ET1′, less fluorine is used in the plasma etching process, suchthat the portion of the spacer material layer 170′ in the recesses R1′can be removed.

In FIG. 20 , spacer material layers 190′ are formed to fill the recessesR1′. The spacer material layers 190′ may be a low-k dielectric material,such as SiO₂, SiN, SiC, SiON, SiCN, or SiOCN, and may be formed by asuitable deposition method, such as ALD. The spacer material layers 190′can be formed using CVD, including LPCVD and PECVD, PVD, ALD, or othersuitable processes. The spacer material layers 190′ and the spacermaterial layer 170′ are made of different materials.

Referring to FIG. 21 , after the deposition of the spacer materiallayers 190′, another anisotropic etching process ET2 may be performed totrim the deposited spacer material layers 190′, such that portions ofthe deposited spacer material layers 190′ that deposited in the bottomof the recesses R1′ left by the etching of the fin structures 130 areleft. After the trimming process, the remaining portions of thedeposited spacer material are denoted as bottom dielectric structures192 in the recesses R1′, for the sake of simplicity.

In some embodiments, the anisotropic etching process ET2 is a plasmaetching. The substrate 110 having the structure illustrated in FIG. 20can be loaded into a plasma tool and exposed to a plasma environmentgenerated by RF or microwave power in a gaseous mixture of a fluorinecontaining gas, such as CHF₃, CF₄, C₄F₈, C₅F₈, C₄F₆, or similar species,an inert gas, such as argon or helium, for a duration time sufficient toetch portions of the spacer material layers 190′ outside the recessesR1′. A plasma generated in a gaseous mixture including CHF₃, CF₄ andargon can be used to tune the shape of the bottom dielectric structures192. With more fluorine, the lateral etching rate of the plasma etchingis increased, and more amount of the bottom dielectric structures 192remains. The plasma is generated by RF power with a bias greater than 0and equal to or less than about 30 V. If the bias is greater than about30V, the bottom dielectric structures 192 may be completely removed; ifthe bias is absent, the inner dielectric spacers 172 may be etched.

Referring to FIG. 22 , after the etching process ET2 in FIG. 21 iscomplete, the structure of FIG. 21 undergoes the processes similar toFIGS. 9A-14 . That is, the source/drain epitaxial structures 180 areformed over the source/drain regions SID of the semiconductor fins 130and the bottom dielectric structures 192. The ILD layer 210 is formed onthe substrate 110. The dummy gate structures 150 are replaced with thegate structures 220. The dielectric caps 230 are optionally formed overthe etched-back gate structures 220. The source/drain contacts 240 areformed extending through the ILD layer 210 (and the CESL layer, ifpresent). Materials and fabrication process details about theaforementioned processes/elements are similar to that shown in FIGS.9A-14 , and thus they are not repeated herein for the sake of brevity.

As mentioned above, the bottom dielectric structures 192 may be made ofa material different from that of the inner dielectric spacers 172. Insome embodiments, the inner dielectric spacers 172 and the bottomdielectric structures 192 have etching selectivity, such that theanisotropic etching process ET2 in FIG. 21 does not damage the innerdielectric spacers 172. Alternatively or additionally, the innerdielectric spacers 172 include high-k dielectric materials, and thebottom dielectric structures 192 include low-k dielectric materials. Forexample, the inner dielectric spacers 172 include SiNCO, SiN,combinations, or the like, and the bottom dielectric structures 192include SiO, SiC, combinations, or the like. Since the bottom dielectricstructures 192 are low-k dielectric materials, the parasitic capacitanceof the integrated circuit structure 100 e can be reduced. Other relevantstructural and manufacturing details of the integrated circuit structure100 e are substantially the same or similar to the integrated circuitstructure 100 of FIG. 14 , and, therefore, a description in this regardwill not be repeated hereinafter.

Based on the above discussions, it can be seen that the presentdisclosure offers advantages. It is understood, however, that otherembodiments may offer additional advantages, and not all advantages arenecessarily disclosed herein, and that no particular advantage isrequired for all embodiments. One advantage is that the bottomdielectric structures improve the current leakage problems between thesource/drain epitaxial structures through the substrate, thereby alsoimproves the drain induced barrier lowering (DIBL) problem of theintegrated circuit structure. Another advantage is that the material ofthe bottom dielectric structure can be chosen to lower the parasiticcapacitance of the integrated circuit structure.

According to some embodiments, a device includes a substrate, a channellayer, a gate structure, a source/drain epitaxial structure, and abottom dielectric structure. The channel layer is over the substrate.The gate structure is over the substrate and surrounds the channellayer. The source/drain epitaxial structure is over the substrate and isconnected to the channel layer. The bottom dielectric structure isbetween the source/drain epitaxial structure and the substrate.

According to some embodiments, a device includes a plurality of channellayers, a gate structure, a source/drain epitaxial structure, an innerdielectric spacer, and a bottom dielectric structure. The channel layersare arranged one above another in a spaced apart manner over asubstrate. The gate structure surrounds each of the plurality of channellayers. The source/drain epitaxial structure is connected to the channellayers. The inner dielectric spacer is between the source/drainepitaxial structure and the gate structure. The bottom dielectricstructure is below the source/drain epitaxial structure.

According to some embodiments, a method includes forming a fin structurecomprising a plurality of first semiconductor layers and a plurality ofsecond semiconductor layers alternately stacked over a substrate. Adummy gate structure is formed across the fin structure such that thedummy gate structure covers a first portion of the fin structure whilesecond portions of the fin structure are exposed. The exposed secondportions of the fin structure are removed. A portion of the substrateunder the exposed second portions of the fin structure is removed toform a recess in the substrate. A bottom dielectric structure is formedin the recess of the substrate. After forming the bottom dielectricstructure, a source/drain epitaxial structure is formed on opposite endsurfaces of the second semiconductor layers in the first portion of thefin structure. The dummy gate structure is removed to expose the firstportion of the fin structure. The first semiconductor layers in theexposed first portion of the fin structure is removed while leaving thesecond semiconductor layers in the exposed first portion of the finstructure suspended above the substrate. A gate structure is formed tosurround each of the suspended second semiconductor layers.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A device comprising: a substrate; a channel layerover the substrate along a stacking direction; a gate structure over thesubstrate and surrounding the channel layer; a source/drain epitaxialstructure over the substrate and connected to the channel layer; and abottom dielectric structure between the source/drain epitaxial structureand the substrate, wherein a bottom surface of the bottom dielectricstructure is convex, and a portion of the bottom dielectric structure incontact with a topmost portion of the substrate is misaligned with thechannel layer along the stacking direction.
 2. The device of claim 1,wherein the bottom dielectric structure is embedded in the substrate. 3.The device of claim 1, wherein a top surface of the bottom dielectricstructure is lower than the top surface of the substrate.
 4. The deviceof claim 1, wherein a top surface of the bottom dielectric structure ishigher than the top surface of the substrate.
 5. The device of claim 1,wherein the source/drain epitaxial structure is spaced apart from thesubstrate.
 6. The device of claim 1, wherein the source/drain epitaxialstructure is in contact with the bottom dielectric structure.
 7. Thedevice of claim 1, wherein the bottom dielectric structure comprisesopposite edge portions and a center portion between the opposite edgeportions in a cross-sectional view, and a vertical thickness of thecenter portion is greater than a vertical thickness of each of theopposite edge portions.
 8. A device comprising: a plurality of channellayers arranged one above another in a spaced apart manner over asubstrate; a gate structure surrounding each of the plurality of channellayers; a source/drain epitaxial structure connected to the channellayers; an inner dielectric spacer between the source/drain epitaxialstructure and the gate structure; and a bottom dielectric structurebelow the source/drain epitaxial structure, wherein a lowest portion ofthe inner dielectric spacer is in contact with the substrate and spacedapart from the bottom dielectric structure.
 9. The device of claim 8,wherein the inner dielectric spacer and the bottom dielectric structureare made of different materials.
 10. The device of claim 8, wherein adielectric constant of the bottom dielectric structure is lower than adielectric constant of the inner dielectric spacer.
 11. The device ofclaim 8, wherein the source/drain epitaxial structure and the innerdielectric spacer define a void therebetween.
 12. A method comprising:forming a fin structure comprising a plurality of first semiconductorlayers and a plurality of second semiconductor layers alternatelystacked over a substrate; forming a dummy gate structure across the finstructure such that the dummy gate structure covers a first portion ofthe fin structure while second portions of the fin structure areexposed; removing the exposed second portions of the fin structure;performing an etching process to remove a portion of the substrate underthe exposed second portions of the fin structure to form a recess in thesubstrate; forming a bottom dielectric structure in the recess of thesubstrate, comprising: forming a dielectric layer in the recess and incontact with end surfaces of the second semiconductor layers; andetching the dielectric layer to form the bottom dielectric structure;after forming the bottom dielectric structure, forming a source/drainepitaxial structure on the end surfaces of the second semiconductorlayers in the first portion of the fin structure; removing the dummygate structure to expose the first portion of the fin structure;removing the first semiconductor layers in the exposed first portion ofthe fin structure while leaving the second semiconductor layers in theexposed first portion of the fin structure suspended above thesubstrate; and forming a gate structure to surround each of thesuspended second semiconductor layers.
 13. The method of claim 12,wherein etching the dielectric layer is performed with a plasma etchingprocess, and the plasma etching process is performed under an RF powerwith a bias greater than 0 and equal to or less than about 30 V.
 14. Themethod of claim 12, wherein etching the dielectric layer is performedwith a plasma etching process, and a plasma of the plasma etchingprocess is generated from a gaseous mixture comprising CHF₃, CF₄, andargon.
 15. The method of claim 12, further comprising: after removingthe portion of the substrate, laterally recessing the firstsemiconductor layers; and forming an inner dielectric spacer on endsurfaces of the laterally recessed first semiconductor layers.
 16. Themethod of claim 15, wherein forming the bottom dielectric structure inthe substrate and forming the inner dielectric spacer on the endsurfaces of the laterally recessed first semiconductor layers areperformed simultaneously.
 17. The method of claim 15, wherein formingthe inner dielectric spacer on the end surfaces of the laterallyrecessed first semiconductor layers is performed prior to forming thebottom dielectric structure in the substrate.
 18. The method of claim15, wherein a dielectric constant of the bottom dielectric structure islower than a dielectric constant of the inner dielectric spacer.
 19. Themethod of claim 12, wherein the etching process is an anisotropicetching process with a gaseous mixture of HBr and He, and HBr:He is in arange from about 1:1 to about 1:8.
 20. The method of claim 12, whereinforming the recess in the substrate is such that the recess has anaspect ratio in a range from about 1.3 to about 15.